Morgan Stanley's report shows that when the world runs full of driverless cars, annual productivity gains will bring in about $507 billion in revenue. These advantages, as well as other potential benefits of driverlessness, are truly exciting. In early 2017, Intel introduced Intel® GOTM, a brand new automotive solutions across the car, connectivity and cloud. The Intel GO brand introduces several development kits that support different computing performances from next-generation Intel® AtomTM processors to Intel® Xeon® processors, as well as the industry's first 5G-ready driverless development platform.
The complete Intel GO system includes a variety of hardware and software development kits:
• Two versions of the Intel® GOTM Driverless In-Car Development Platform provide unparalleled scalability and performance power optimization. From the next generation of Intel Atom processors to high-performance Intel Xeon processors plus Arria® 10 FPGAs, the two platforms provide the computing power to perform a range of driverless functions, including perception, convergence and decision making.
• The Intel® GOTM Smart Driving 5G Vehicle Communications Platform provides the automotive industry with the industry's first 5G-ready platform, enabling automakers to develop and test applications and applications before the 2020 5G launch as expected.
• The Intel® GOTM Smart Driving Software Development Kit provides several important tools for the driverless industry, including the Deep Learning Toolkit, and provides consistent development experience to help engineers maximize hardware capabilities while Speed ​​up the pace of design.
Intel® GOTM is a versatile platform that provides a distributed architecture and deep learning chip, including FPGAs and X86 chips from less cores to multiple cores. The entire platform is consistent, ensuring customers have a large initial stage. The entire platform can be reduced to a platform that combines performance and cost in the final production phase. The complete, scalable Intel® GOTM platform meets the needs of the entire market. Its platform technology advancement, unparalleled scalability and performance power consumption were nominated for the 2017 China IoT Technology Innovation Award.
Industry leadership
Intel GO Systems leverages the depth and breadth of Intel's product portfolio and expertise to extend years of valuable investment in the automotive industry. At present, hundreds of unmanned vehicles tested on the road use Intel technology. Intel is now advancing to launch a new automotive solutions brand across the car, connectivity and cloud - Intel® GOTM.
Key points of innovation
This scalable vehicle-to-cloud approach will drive the automotive industry to accelerate the unmanned future. It brings great flexibility to the design of automakers and suppliers, while bringing a new experience to the market at a faster time and at a lower cost. The complete Intel GO system includes a variety of hardware and software development kits:
Two versions of the Intel® GOTM Driverless In-Car Development Platform offer unparalleled scalability and performance power optimization. From the next generation of Intel Atom processors to high-performance Intel Xeon processors plus Arria® 10 FPGAs, the two platforms provide the computing power to perform a range of driverless functions, including perception, convergence and decision making.
The Intel® GOTM Smart Driving 5G Vehicle Communications Platform provides the automotive industry with the industry's first 5G-ready platform, enabling automakers to develop and test applications and applications before the 2020 5G launch as expected.
The Intel® GOTM Smart Driving Software Development Kit provides several important tools for the driverless industry, including the Deep Learning Toolkit, and provides consistent development experience to help engineers maximize hardware capabilities while accelerating Design pace.
Intel
Intel is committed to expanding the boundaries of technology to make the best experience possible.
2017 China IoT Conference Introduction
The China IoT Conference was held by Huaqiang Jufeng's Million Electronic Engineer Platform Electronic Enthusiasts Network. The conference has been successfully held for 3 sessions. In the form of “Grand Forum + Sub-forumâ€, 100+ global famous manufacturers have gathered and successfully attracted 6,000+. The names of electronic semiconductor practitioners signed up for the event, affecting 200,000+ electronic engineers.
We are committed to guiding China's IoT wind vane, gathering global IoT industry leaders, analyzing the potential market value of various industries, exposing the latest technology solutions, providing the best communication platform, and striving to build an IoT ecosystem with many partners.
Time: December 6-7, 2017
Location: Shenzhen, China
Expected size: 2,000+
Conference planning:
Morning of December 6th: IoT Development Summit
Afternoon of December 6th: Four Technology Forums (Sensors, IoT Security, Power Management, Artificial Intelligence) + Seven Application Forums (Smart Home, Wearables, Smart City, Smart Lighting, Smart Machines/Unmanned Vehicles, Industrial Products) Networking, smart car)
Evening on December 6th: Awards Ceremony, Strategic Cooperation Exchange Dinner; during the dinner: New CEO Award (10), Technology Innovation Award (20), Product Golden Lion Award (30)
Morning of December 7: Analyst Breakfast Meeting, IoT Investment Forum
2017 China IoT New CEO Award is now in the hot nomination, please click here. The deadline for nominations is September 30th.
The 2017 China IoT Technology Innovation Award is now in the hot nomination, please click here. The deadline for nominations is September 30th.
The 2017 China IoT Product Golden Lion Award is now in hot nomination, please click here. The deadline for nominations is September 30th.
Vertical Mount Power D-SUB Connectors
ANTENK launches series vertical board mount Power-D & Combo-D D-SUB connectors machined contacts.
The ANTENK Power-D & Combo-D mixed contact d-sub connectors straight are designed for rugged / robust applications where both power & signal are required from a single connection. Featuring [Solid-Pin" machined contacts, these connectors offer high reliability performance for the most challenging design applications.
vertical board mount Power-D & Combo-D D-SUB connectors machined contacts applications
The ANTENK vertical mount combo d-sub, mixed contact connector product range is ideal for a multitude of both IP rated and non-rated industry applications. This diverse combo d-sub standard product offering includes up to 13 contact configurations (seen below) engineered for both power & coaxial connector environments such as satellite & weather stations, GPS receivers, transceivers and radio technology applications. Contact us directly for any custom or semi-custom combo d-sub connector project not listed in our standard product offering above.
Features of Vertical Mount D-SUB Connector Machined Contacts
Available in 12 industry standard sizes / positions.
Contact Antenk for other sizes / contact configurations.
Available in 10/20/30/40 amp power contacts, 5 amp signal
Allows signal, high current & high voltage in one connector.
Contacts are pre-loaded into the insulator.
Material of Vertical Mount D-SUB Connector Machined Contacts
Shell: Steel, Nickel plated
Insulator: Glass-Filled Thermoplastic, U.L. 94V-O, Black
Signal Contacts: Machined Copper Alloy, Full Gold Flash
Power Contacts: Machined Copper Alloy, Full Gold Flash
Male High Density Power D Mixed Contact Connectors, Female High Density Power D Mixed Contact Connectors, Male Standard Vertical Mount Power D-SUB Connector, Female Standard Vertical Mount Power D-SUB Connector
ShenZhen Antenk Electronics Co,Ltd , https://www.pcbsocket.com