[Source: "High-tech LED-technology and application" June issue / Xu Yongxian]
This paper introduces the preparation method of additive two-component liquid silicone resin for COB package (LED), and uses homemade liquid silicone resin for COB (chip on board) LED packaging. Regular temperature lighting test, high temperature lighting test, reflow soldering test, -40 ~ 100 ° C thermal shock test and normal temperature ink penetration test, high temperature ink penetration test and other indicators are qualified, its performance can be comparable with similar foreign products .
As a pioneer in global lighting tools, incandescent lamps are gradually being replaced by new generation lighting tools (LEDs), which are gradually fading out of people's lives. The color variety, brightness and power of LEDs have changed dramatically over the past few years. As a new high-efficiency solid-state light source, LED has the advantages of small size, energy saving, environmental protection, etc., so it is widely used in indicators, displays and backlights, and plays an unparalleled role in traditional light sources; They have not yet been fully functional in the home and public lighting arena. Silicone materials are laying the foundation for LED lighting tools to enter thousands of households with their excellent performance.
An LED is a light-emitting semiconductor material that is a light-emitting display device that can directly convert electrical energy into light energy. The heart of the LED is a semiconductor wafer that emits light when powered. The light source can be controlled by a concentrating lens or a diverging lens, which is usually made of a material such as silicone rubber/silicone, plastic, glass, or the like. LEDs are widely used in the fields of screen display systems, indicator lights, mobile phones or digital products, etc. due to their advantages of easy control, low-voltage DC drive, low power consumption, high stability, short response time, and multi-color illumination. The application of landscape lighting, interior decorative lights, car lights, and mine lights has also been actively developed. At present, the packaging material of LED is mainly epoxy resin; however, its heat resistance and light resistance are insufficient, and it is easy to turn yellow due to heat, which cannot meet the packaging requirements of high-brightness light-emitting diodes (high-power LEDs). The silicone material has good optical properties and light transmittance of over 90%. It does not yellow under weathering, heat and high temperature environments, attracts impact, has good adhesion, is soft and environmentally friendly, and is gradually replacing epoxy resin as LED. The main bonding, packaging, coating and optical materials. The application of silicone materials in the field of LED production has undoubtedly become an important factor driving the development of LED lighting.
In this experiment, an additive two-component liquid silicone resin was prepared and applied to the package of COB (chip on board) LED. This experiment mainly tested the COB (chip on board) type LED in the liquid silicone rubber package. Ink penetration, reflow soldering, normal temperature lighting aging, high temperature lighting aging, high temperature and high humidity, thermal shock and other properties, according to the reliability of the test to evaluate whether liquid silicone rubber samples are suitable for COB (chip on board) LED packaging products process . The COB package (chip on board) is to adhere the bare chip to the interconnect substrate with a conductive or non-conductive paste, and then perform wire bonding to realize electrical connection. If the bare chip is directly exposed to the air, susceptible to contamination or man-made damage, affecting or destroying the function of the chip, the chip and the bonding wire are encapsulated with silicone. This package is also referred to as a soft encapsulation.
experiment
1.1 Main raw materials and instruments
Tetramethyldivinyldisiloxane, vinyl ring: Ningbo Hengchang New Material Co., Ltd.; octamethylcyclotetrasiloxane (D4): KF-994, Shin-Etsu Chemical Co., Ltd.; hydrogen-containing silicone oil :KF-99, Shin-Etsu Chemical Co., Ltd.; tetramethylammonium hydroxide: Beijing Chaofu Experimental Chemical Plant; silane coupling agent A-186 (β-(3,4 epoxycyclohexyl)-ethyltrimethoxy Silane): Shenzhen Superior Changhao Technology Co., Ltd.; tetramethyldihydrodisiloxane: Jiaxing United Chemical Co., Ltd.; hexamethyldisiloxane (MM): Zhejiang Xinan Chemical Group Co., Ltd.; water glass: The mass fraction of SiO2 is 17.8%, the mass ratio of SiO2/Na2O is 3.37, Dali Zhongfa Water Glass Factory, Nanhai District, Foshan City; vinyl silicone oil: 5000mPa.s, vinyl mole fraction 0.9%; inhibitor acetylene cyclohexanol: Anhui Yuhong Silicone Materials Co., Ltd.; Platinum Complex: Self-made [1]; Silicone rubber for optoelectronic packaging for comparative experiments: KER-2500, OE-6636, IVS6033-6, respectively, Shin-Etsu Chemical Co., Ltd., Dow Corning Corporation, Momentive; COB LED: 546, Hong Kong Zhen Mingli Group.
Powerful electric mixer: JBD-90, Shanghai specimen mold factory; rotary viscometer: NDJ-79, Tongji University machine power plant; rotor viscosity meter: NDJ-1 type, Shanghai Jinke Instrument Equipment Factory; electro-optical analysis balance: TG-380B, Shanghai Test Instrument Factory; three-roll mill: SY-150, Changzhou Bafang Machinery Factory; tensile test machine: GT-7010-AE, high-speed rail (Dongguan) Testing Instrument Co., Ltd.; punching machine: GT-7016- A, high-speed rail (Dongguan) Testing Instrument Co., Ltd.; hardness tester: LX-A, Shanghai Rubber Test Factory; wafer: CB10G02 Ronda 6G, Taiwan Longda Electronics Co., Ltd.; COB ceramic substrate or aluminum substrate: semi-plated, Hong Kong Zhen Mingli Company; Phosphor: Yucai UC460-B, Dalian Luming New Materials Co., Ltd.
Electric cooker: 2L, Jiangsu Jianhu Experimental Instrument Equipment Factory; Water Bath: Model GH-10, Guangzhou Chemical Glass Instrument Supply Station; Planetary Mixer: 2L, Foshan Jinyinhe Machinery Equipment Co., Ltd.; Microscope: Model XHC-SE, Dongguan Maite Optical Instrument Co., Ltd.; high power lighting: TC-CSP06 Shenzhen Zhonghexin Technology Co., Ltd.; constant temperature and humidity machine: MHU-408CASA, Shenzhen Zhonghexin Technology Co., Ltd.; thermal shock machine: TS-T2CATT , Dongguan Hongzhan Instrument Co., Ltd.; push-pull test machine: AEF-10, Shenzhen Weichuang Keyi Precision Instrument Co., Ltd.; LED photoelectric comprehensive tester: model ZW-900, Hangzhou Zhongwei Photoelectric Technology Co., Ltd.; high power Aging equipment: HP600, Hangzhou Zhongchuang Electronics Co., Ltd.; SMT placement machine: XHF-5100, Waters Technology (Shanghai) Co., Ltd.; automatic dispensing machine: SEC-3030A, Shenzhen Shiyi Automation Equipment Co., Ltd.
For more information, please refer to the June issue of "High-tech LED-Technology and Applications" magazine.
This paper introduces the preparation method of additive two-component liquid silicone resin for COB package (LED), and uses homemade liquid silicone resin for COB (chip on board) LED packaging. Regular temperature lighting test, high temperature lighting test, reflow soldering test, -40 ~ 100 ° C thermal shock test and normal temperature ink penetration test, high temperature ink penetration test and other indicators are qualified, its performance can be comparable with similar foreign products .
As a pioneer in global lighting tools, incandescent lamps are gradually being replaced by new generation lighting tools (LEDs), which are gradually fading out of people's lives. The color variety, brightness and power of LEDs have changed dramatically over the past few years. As a new high-efficiency solid-state light source, LED has the advantages of small size, energy saving, environmental protection, etc., so it is widely used in indicators, displays and backlights, and plays an unparalleled role in traditional light sources; They have not yet been fully functional in the home and public lighting arena. Silicone materials are laying the foundation for LED lighting tools to enter thousands of households with their excellent performance.
An LED is a light-emitting semiconductor material that is a light-emitting display device that can directly convert electrical energy into light energy. The heart of the LED is a semiconductor wafer that emits light when powered. The light source can be controlled by a concentrating lens or a diverging lens, which is usually made of a material such as silicone rubber/silicone, plastic, glass, or the like. LEDs are widely used in the fields of screen display systems, indicator lights, mobile phones or digital products, etc. due to their advantages of easy control, low-voltage DC drive, low power consumption, high stability, short response time, and multi-color illumination. The application of landscape lighting, interior decorative lights, car lights, and mine lights has also been actively developed. At present, the packaging material of LED is mainly epoxy resin; however, its heat resistance and light resistance are insufficient, and it is easy to turn yellow due to heat, which cannot meet the packaging requirements of high-brightness light-emitting diodes (high-power LEDs). The silicone material has good optical properties and light transmittance of over 90%. It does not yellow under weathering, heat and high temperature environments, attracts impact, has good adhesion, is soft and environmentally friendly, and is gradually replacing epoxy resin as LED. The main bonding, packaging, coating and optical materials. The application of silicone materials in the field of LED production has undoubtedly become an important factor driving the development of LED lighting.
In this experiment, an additive two-component liquid silicone resin was prepared and applied to the package of COB (chip on board) LED. This experiment mainly tested the COB (chip on board) type LED in the liquid silicone rubber package. Ink penetration, reflow soldering, normal temperature lighting aging, high temperature lighting aging, high temperature and high humidity, thermal shock and other properties, according to the reliability of the test to evaluate whether liquid silicone rubber samples are suitable for COB (chip on board) LED packaging products process . The COB package (chip on board) is to adhere the bare chip to the interconnect substrate with a conductive or non-conductive paste, and then perform wire bonding to realize electrical connection. If the bare chip is directly exposed to the air, susceptible to contamination or man-made damage, affecting or destroying the function of the chip, the chip and the bonding wire are encapsulated with silicone. This package is also referred to as a soft encapsulation.
experiment
1.1 Main raw materials and instruments
Tetramethyldivinyldisiloxane, vinyl ring: Ningbo Hengchang New Material Co., Ltd.; octamethylcyclotetrasiloxane (D4): KF-994, Shin-Etsu Chemical Co., Ltd.; hydrogen-containing silicone oil :KF-99, Shin-Etsu Chemical Co., Ltd.; tetramethylammonium hydroxide: Beijing Chaofu Experimental Chemical Plant; silane coupling agent A-186 (β-(3,4 epoxycyclohexyl)-ethyltrimethoxy Silane): Shenzhen Superior Changhao Technology Co., Ltd.; tetramethyldihydrodisiloxane: Jiaxing United Chemical Co., Ltd.; hexamethyldisiloxane (MM): Zhejiang Xinan Chemical Group Co., Ltd.; water glass: The mass fraction of SiO2 is 17.8%, the mass ratio of SiO2/Na2O is 3.37, Dali Zhongfa Water Glass Factory, Nanhai District, Foshan City; vinyl silicone oil: 5000mPa.s, vinyl mole fraction 0.9%; inhibitor acetylene cyclohexanol: Anhui Yuhong Silicone Materials Co., Ltd.; Platinum Complex: Self-made [1]; Silicone rubber for optoelectronic packaging for comparative experiments: KER-2500, OE-6636, IVS6033-6, respectively, Shin-Etsu Chemical Co., Ltd., Dow Corning Corporation, Momentive; COB LED: 546, Hong Kong Zhen Mingli Group.
Powerful electric mixer: JBD-90, Shanghai specimen mold factory; rotary viscometer: NDJ-79, Tongji University machine power plant; rotor viscosity meter: NDJ-1 type, Shanghai Jinke Instrument Equipment Factory; electro-optical analysis balance: TG-380B, Shanghai Test Instrument Factory; three-roll mill: SY-150, Changzhou Bafang Machinery Factory; tensile test machine: GT-7010-AE, high-speed rail (Dongguan) Testing Instrument Co., Ltd.; punching machine: GT-7016- A, high-speed rail (Dongguan) Testing Instrument Co., Ltd.; hardness tester: LX-A, Shanghai Rubber Test Factory; wafer: CB10G02 Ronda 6G, Taiwan Longda Electronics Co., Ltd.; COB ceramic substrate or aluminum substrate: semi-plated, Hong Kong Zhen Mingli Company; Phosphor: Yucai UC460-B, Dalian Luming New Materials Co., Ltd.
Electric cooker: 2L, Jiangsu Jianhu Experimental Instrument Equipment Factory; Water Bath: Model GH-10, Guangzhou Chemical Glass Instrument Supply Station; Planetary Mixer: 2L, Foshan Jinyinhe Machinery Equipment Co., Ltd.; Microscope: Model XHC-SE, Dongguan Maite Optical Instrument Co., Ltd.; high power lighting: TC-CSP06 Shenzhen Zhonghexin Technology Co., Ltd.; constant temperature and humidity machine: MHU-408CASA, Shenzhen Zhonghexin Technology Co., Ltd.; thermal shock machine: TS-T2CATT , Dongguan Hongzhan Instrument Co., Ltd.; push-pull test machine: AEF-10, Shenzhen Weichuang Keyi Precision Instrument Co., Ltd.; LED photoelectric comprehensive tester: model ZW-900, Hangzhou Zhongwei Photoelectric Technology Co., Ltd.; high power Aging equipment: HP600, Hangzhou Zhongchuang Electronics Co., Ltd.; SMT placement machine: XHF-5100, Waters Technology (Shanghai) Co., Ltd.; automatic dispensing machine: SEC-3030A, Shenzhen Shiyi Automation Equipment Co., Ltd.
For more information, please refer to the June issue of "High-tech LED-Technology and Applications" magazine.
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