[Text / high-tech LED reporter Zhou Jin] LED packaging process with the change of chip structure, has been followed by a process of continuous innovation, especially the emergence of flip-chip LED chip technology, bringing the largest LED packaging and assembly The simplification of the process has greatly helped the packaging company to reduce the investment in equipment and manpower.
For packaging material manufacturers at the front end, the change in material requirements brought about by the new process has prompted new packaging materials to become the key to material manufacturers' market share in the next stage.
At the 2013 Hi-Tech LED Lighting Exhibition, which will be held at the Guangzhou Poly Exhibition Hall on November 25th, Shenzhen Chenri Technology Co., Ltd., which is mainly engaged in packaging materials, will present the latest LED packaging materials and lamps developed this year.
Duan Jianxun, deputy general manager of Morning Technology, said that the company has always been based on flip-chip LED integrated manufacturing process, with the current mainstream COB packaging process and future flip chip packaging process as the entry point, through three core materials ( Solid crystal solder paste, dam glue, jelly glue – one-component silica gel and phosphor blend) to create the most simplified LED luminaire manufacturing solution.
“COB technology and process are becoming more and more mature, and its demand is gradually increasing. The dam rubber and COB glue suitable for COB surface light source packaging and point light source packaging have become two extremely important products for the company's entire strategy to develop the market. It is also hoped that the opportunity of the high-tech LED lighting exhibition will be highly recommended to the industry." Duan Jianxun revealed that the company will also bring the main product - COB packaging silicone.
After the launch of COB dam glue and COB glue of Chenri Technology, it has won the reputation of many customers. Duan Jianxun introduced that the reason for the good market response is that the new product is well formed and easy to operate; the strength is high and it is not easy. Tear; good sealing, can meet the demanding requirements of red ink, and can also be made into different colors such as pure white and transparent.
In addition, Duan Jianxun said that some of the lighting products packaged with morning technology advantages materials will also debut at the high-tech LED lighting exhibition. “In order to make our customers understand the excellence of our new materials more intuitively, these lamps will also more intuitively reflect the advantages of our materials in specific applications.â€
For packaging material manufacturers at the front end, the change in material requirements brought about by the new process has prompted new packaging materials to become the key to material manufacturers' market share in the next stage.
At the 2013 Hi-Tech LED Lighting Exhibition, which will be held at the Guangzhou Poly Exhibition Hall on November 25th, Shenzhen Chenri Technology Co., Ltd., which is mainly engaged in packaging materials, will present the latest LED packaging materials and lamps developed this year.
Duan Jianxun, deputy general manager of Morning Technology, said that the company has always been based on flip-chip LED integrated manufacturing process, with the current mainstream COB packaging process and future flip chip packaging process as the entry point, through three core materials ( Solid crystal solder paste, dam glue, jelly glue – one-component silica gel and phosphor blend) to create the most simplified LED luminaire manufacturing solution.
“COB technology and process are becoming more and more mature, and its demand is gradually increasing. The dam rubber and COB glue suitable for COB surface light source packaging and point light source packaging have become two extremely important products for the company's entire strategy to develop the market. It is also hoped that the opportunity of the high-tech LED lighting exhibition will be highly recommended to the industry." Duan Jianxun revealed that the company will also bring the main product - COB packaging silicone.
After the launch of COB dam glue and COB glue of Chenri Technology, it has won the reputation of many customers. Duan Jianxun introduced that the reason for the good market response is that the new product is well formed and easy to operate; the strength is high and it is not easy. Tear; good sealing, can meet the demanding requirements of red ink, and can also be made into different colors such as pure white and transparent.
In addition, Duan Jianxun said that some of the lighting products packaged with morning technology advantages materials will also debut at the high-tech LED lighting exhibition. “In order to make our customers understand the excellence of our new materials more intuitively, these lamps will also more intuitively reflect the advantages of our materials in specific applications.â€
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