Texas Instruments (TI) today announced the launch of the WiLinkTM 8.0 product line, marking another milestone in the development of wireless connectivity technology. The 45nm single-chip solution integrates up to five different radios, paving the way for next-generation mobile applications such as Wi-Fi®, GNSS, NFC, Bluetooth® and FM transceivers. The WiLink 8.0 architecture supports a variety of combinations of these technologies to help custom solutions meet the unique needs and price point requirements of all mobile markets. Each different chip combines a compact WSP package that can be mounted directly onto the PCB, and integrates all required RF front ends, a complete power management system, and a comprehensive and comprehensive coexistence mechanism. At the system level, the five radio WiLink 8.0 chips can reduce costs by 60%, size by 45%, and power consumption by 30% compared to traditional multi-chip products.
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Gartner Research Director Mark Hung said: "The annual shipments of mobile connected devices are expected to exceed 3 billion units by 2015*. Manufacturers are demanding that semiconductor solutions not only achieve the best user experience, but also expand to meet a variety of different needs. Product platform requirements. One size does not meet all needs: different applications have different size, power and performance requirements. Innovations in functional integration, power reduction and scalability will accelerate the time-to-market and help manufacturers build Future mobile connections."
WiLink 8.0 Series: 15 products, open unlimited motion possible
The WiLink 8.0 Series includes a highly integrated WL189x solution with five radios for smartphones, tablets, eBooks, ultra-thin computing devices and other feature-rich mobile products. The WL187x, WL185x and WL183x offer more options for higher and mid-range mobile devices, while the WL180x solution is suitable for the lower cost mobile market. The product line includes integrated RF front ends for 2.4GHz and 5GHz.
Haviv IIan, TI's vice president and general manager of the Wireless Connectivity Solutions business unit, said: "The introduction of WiLink 8.0 and other high-integration 5-in-1 radio chips into the market requires the development of sophisticated wireless technologies using coexisting low-power mechanisms. TI's expertise over the past decade. The integrated WiLink 8.0 family reflects our leadership in innovation, paving the way for a new generation of connected experiences across all mobile devices."
Main features and advantages
The industry's best Wi-Fi for mobile applications: The WiLink 8 solution is available for all Wi-Fi throughput ranges, whether using 2x2 MIMO or SISO 40MHz. Supporting over 100Mbps Wi-Fi TCP throughput in the 2.4GHz and 5GHz bands, the chip delivers the fastest mobile streaming and HD mobile video capabilities, including Wi-Fi DirectTM and wireless display, and support Low latency, low power and open source software. Compared to other MIMO solutions, WiLink 8.0 with integrated Wi-Fi MIMO is down 25% in size and consumes 50% in power consumption.
Industry's First Integrated NFC Controller Solution: As the first integrated chip family to embed a complete NFC controller solution, WiLink 8.0 devices make NFC integration even easier on any mobile product. Compared to non-integrated solutions, the integrated NFC-enabled WiLink 8.0 integrated chip is more than 50% smaller. The WiLink 8.0 chip can be pre-tested with the best Secure Element technology from industry leaders such as Infineo and NXP to provide tight protection for NFC transactions.
Juergen Spaenkuch, vice president of Infineon Technologies and general manager of the chip card platform security and security business unit, said: "TI's latest WiLink single-chip solution will set off a new wave of innovation in portable platform design. The latest WiLink series can be combined with Infineon The embedded secure component solution with high-performance open DCLB interface works perfectly to optimize the connection between eSE and NFC modems. eSE is certified by EMVCo and Common Criteria EAS 5+ (high) and provides a level of security A variety of applications for NFC, including mobile payments, access control, ticketing, and electronic keys."
Available technology options | WL189x solution | WL187x solution | WL185x solution | WL183x solution | WL180x solution |
Dual-band 2x2 MIMO mobile | WL1897 | WL1877 | WL1857 | WL1837 | WL1807 |
Wi-Fi 802.11 a/b/g/n | WL1893 | WL1873 | WL1853 | WL1833 | WL1803 |
Wi-Fi 802.11 b/g/n | WL1891 | WL1871 | WL1851 | WL1831 | WL1801 |
Wi-Fi SS 40MHz (HT40) | * | * | * | * | * |
GNSS | * | * | Â | Â | Â |
Bluetooth technology | * | * | * | * | Â |
Bluetooth low energy technology | * | * | * | * | Â |
ANT+TM | * | * | * | * | Â |
NFC | * | Â | * | Â | Â |
FM transceiver | * | * | * | * | Â |
Jeff Miles, vice president of mobile trading at NXP Semiconductors, said: "NXP is pleased to partner with TI on the market's first five-in-one integrated connectivity solution. Combining NXP chips with wireless connectivity solutions, NXP will continue to lead The evolution and development of the mobile trading market. NXP will continue to innovate to provide the industry's best security components and independent NFC controllers. With the development of the mobile trading market, powerful innovators provide complementary solutions to meet each It is important to segment market demand and further promote market development."
Omni-directional positioning, time-aware hybrid positioning: In addition to standard GPS and GLONASS receivers, the WiLinK 8.0 GNSS core also includes a complete on-chip positioning engine, which significantly reduces system-level power consumption and supports host-independent on-chip area limiting and location caching. , thereby enhancing the environment sensing function. The WiLink 8.0 solution combines superior GNSS and Wi-Fi sensor systems with Bluetooth low energy, ANT+ and NFC enhancements to provide best-in-class positioning.
Availability
The WiLink 8.0 solution is now sampling for advanced mobile OEMs and will be demonstrated at the 8A84 TI booth at Mobile World Congress in Barcelona from February 27th to March 1st. Products with built-in WiLink 8.0 solution will be available in 2012. Supply in the second half of the year.
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