The US venture company Intermolecular has released the "High-Productivity Combinatorial (HPC)" technology (published in English) that can significantly shorten the development of new materials semiconductor processes. This technology applies the “combinatorial technology†of material search methods used in medicine and biology to the development of semiconductor processes. According to the introduction, in an application case, the previous method requires more than 20 years of material screening work, which can be completed in only 5 weeks.
The meaning of combinatorial is "combination", which combines various trace compounds in various combinations to select the desired compound. Previously, the semiconductor process used a single material to form the entire wafer surface and then evaluated it, so the efficiency was low. This method is to divide one wafer into multiple regions, and test the chip by changing the materials of each region to evaluate the electrical characteristics.
For example, the company called the "Tempus F-30" device, which places 28 small containers on a 300mm wafer, injects different chemicals into each container, and processes the wafer. In this way, 28 processes can be evaluated simultaneously on one wafer. If the sputtering treatment is performed, a small container is not used, and instead, the mask is sequentially moved to complete 28 kinds of film formation. According to reports, in a device called "Tempus F-20" and "Tempus F-10", small containers can be configured at a higher density, so that more processes can be evaluated simultaneously.
The company will provide this technology in three ways: (1) co-development with users, (2) device sales, and (3) technology licensing. Devices supporting the wet process are currently available, and by 2008, devices supporting sputtering and ALD will be available. The technology has been published in "SEMICON West 2007" and "has caused a lot of resounding" (the company).
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The meaning of combinatorial is "combination", which combines various trace compounds in various combinations to select the desired compound. Previously, the semiconductor process used a single material to form the entire wafer surface and then evaluated it, so the efficiency was low. This method is to divide one wafer into multiple regions, and test the chip by changing the materials of each region to evaluate the electrical characteristics.
For example, the company called the "Tempus F-30" device, which places 28 small containers on a 300mm wafer, injects different chemicals into each container, and processes the wafer. In this way, 28 processes can be evaluated simultaneously on one wafer. If the sputtering treatment is performed, a small container is not used, and instead, the mask is sequentially moved to complete 28 kinds of film formation. According to reports, in a device called "Tempus F-20" and "Tempus F-10", small containers can be configured at a higher density, so that more processes can be evaluated simultaneously.
The company will provide this technology in three ways: (1) co-development with users, (2) device sales, and (3) technology licensing. Devices supporting the wet process are currently available, and by 2008, devices supporting sputtering and ALD will be available. The technology has been published in "SEMICON West 2007" and "has caused a lot of resounding" (the company).
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