TSMC's subsidiary, 2330, specializes in wafer-level high-power LED 矽-based packaging technology. In 2010, the product entered the Chinese streetlight market. In 2011, it focused on indoor lighting bulb products, which will face competitors. Billion Light (2393), Lite-On (2301).
The pick was established at the end of 2003. At present, it has not yet planned to apply for listing, but the unlisted price is about 33-37 yuan.
Li Yuhua, director of research and development of LED technology, said that the company's packaging capacity is 2,000 pieces per month, equivalent to 4 million pieces. Last year, the products successfully entered Chinese street lamp products. The monthly shipments are as high as 700,000-800,000.
Cai specializes in LED lighting, there is no plan to enter the LED large-size backlight, and in 2012, Taiwan, Japan, the United States, Canada will begin to ban the incandescent bulbs policy, picking that the third quarter of 2011 LED warm white bulb The sales volume of lamps will grow explosively, and the company will also include bulb lamps in this year's development focus.
It is worth noting that the pick-up uses wafer-level LED germanium-based packaging technology, which is different from the alumina (sapphire) substrate technology used by general LED packaging manufacturers in Taiwan; Li Yuhua said that the germanium-based packaged LED is superior to the sapphire substrate in heat dissipation, but The current price is also higher than the sapphire substrate.
In the first quarter of 2011, under the effect of the price reduction of the upstream products of the big factory Cree, Taiwan Plant (2448) also followed the price, Li Yuhua believes that the price of the ruthenium-based package and sapphire substrate will tend to be higher in 2011. Consistently, the procurement has set a new target, and the annual cost reduction is as high as 30%.
TSMC is also developing LED upstream epitaxy and die. The industry believes that once TSMC is in mass production, the downstream package will be handed over to the mining company, and will benefit from the Group's mass production of upstream products. Source costs will be more competitive in terms of product prices.
In 2007, é’° é’° æ£å¼ æ£å¼ æ£å¼ æ£å¼ æ£å¼ æ£å¼ æ£å¼ 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 Power LED packaging technology, and began mass production in 2009.
Founded in 2003, the company is a joint venture between TSMC and the image sensor CMOS manufacturer, Meishi Haowei Technology Co., Ltd., which is mainly engaged in the production and service of image sensor after the process, including color filter film manufacturing and back-end packaging. Testing; At present, the company's main products can be divided into three major items, namely color filter film and CMOS image sensor, lens and LED package.
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