Windows CE is an open, croppable, 32-bit real-time embedded operating system. It has the characteristics of high reliability, high real-time performance and small core size, so it is widely used in the development of various embedded intelligent devices. Its applications include industrial control, information appliances, mobile communications, automotive electronics, personal consumer electronics, etc. The field is the most widely used and fastest growing embedded operating system. In these embedded applications, audio modules are an integral part of most products. The audio system based on Intel Xscale PXA272 and TSC2101 audio chip is constructed and its implementation method is briefly introduced.
The audio chip TSC2101 integrates stereo audio decoding and touch screen control chip. The stereo DAC can play audio files at up to 48Kb/s sampling rate, especially for PDA, PMP, smart phone and MP3 player. The TSC2101 integrates a speaker amplifier, headphone amplifier and four-wire touch screen controller with an audio codec, with a stereo headset interface, a handset interface, a mono 8Ω speaker amplifier and a 32Ω receiver driver And integrated with a battery monitor and an on-chip temperature sensor. The circuit design of the TSC2101 chip is shown in Figure 2.
Figure 2 TSC2101 chip circuit design
Circuit principle: This design is the application of TSC2101 in smart phone. CP-IN is the voice input of communication module, CP-OUT is the output of audio system to communication module. In practical application, MIC1 can pass the internal PGA of TSC2101 ( Programmable gain amplification), AGC (Automatic Gain Control) circuit is connected to CP-OUT to realize the microphone function of the smartphone; at the same time, the MIC1 input can also sample the voice data through the internal ADC and transmit it to the processor storage space via the I2S bus. Realize the recording function. Of course, while the smartphone is talking, the call recording function can also be implemented. The 38 to 41 pins in the circuit diagram are SPI interfaces, 42 to 46 pins are I2S control pins, pins 9 to 12 are touch screen inputs, pins 27 and 28 are audio outputs for headphones, and pins 26 are connected to handsets. Pins 33 and 35 are connected to the external speaker.
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