On August 17, 2010, sponsored by Gaogong LED, Dalian Luming Technology Group, Dalian Semiconductor Industry Association, Dalian City Government, Dalian Economic and Information Technology Commission, 2010 LED Illuminated China Tour - National Tour Survey and The sixth seminar of the industry seminar was successfully held in Dalian. The seminar was held in the multi-function hall on the second floor of the Bolt Hotel in Dalian. The meeting held a heated discussion on topics such as technology and patents for the development of the LED industry.
The conference attracted about 100 participants. Liu Yuxi, Director of Semiconductor Division of Dalian Economic and Information Committee, Sun Dapeng, Director of Dalian Jinzhou New District Science and Technology Bureau, Xiao Zhiguo, Chairman of Dalian Luming Technology Group Co., Ltd., and Wuhan Diyuan Optoelectronics Technology Co., Ltd. Manager Dong Zhijiang, sales director of Jiangsu Xinli Optoelectronics Co., Ltd. Gu Zongjun, Ke Rui China senior engineer Wang Xiuru, and Dalian Hongwei Heat Transfer Technology Co., Ltd. general manager Yang Hongwu delivered a speech. Ma Junguo, chief engineer of the Dalian Economic and Information Committee, delivered a speech on behalf of the government.
Yang Hongwu: High-power LED lamp integrated heat pipe cooling module
Yang Hongwu pointed out that 20% of LED light-emitting devices become light when energized, and 80% are converted into heat. Heat dissipation is one of the key technical issues of LED lamps. The technical idea for solving the heat dissipation of LED lamps is natural convection, passive, and large enough. Effective heat dissipation area.
The choice of radiator technology solutions to solve the problem of how to use the minimum temperature difference heat dissipation is essentially the transfer technology and method of heat from heat sink to extended heat sink surface. Compared with the traditional method of metal heat conduction, the heat transfer phase change contact area is small, and the effective heat dissipation area of ​​the loop heat pipe is insufficient, the integrated hot plate two-dimensional phase change heat transfer has great advantages: 1. The integrated hot plate is perpendicular to the heat sink and fully utilized. Heat transfer in the phase change process, the thermal resistance value is 0; 2. The extended heat sink fin is perpendicular to the integrated hot plate, perpendicular to the ground and separated from the heat sink / is conducive to the formation of air convection, which is conducive to the elimination of dust and water accumulation; The integrated hot plate, heat sink and extended heat sink fins are made of aluminum alloy material, and the connection between them is welded structure; 4. The integrated hot plate temperature uniformity △T≤2 °C, 200WLED lamp heat dissipation module heat sink thermal resistance Rt≤ 0.075 ° C / W.
According to Yang Hongwu, the high-power LED lamp of Dalian 3D Heat Transfer Technology Co., Ltd. integrates the hot plate heat dissipation module, the thermal resistance is 15 °C - 30 °C, the weight is 15g / W - 25g / W, and the light efficiency is increased by 3% -5 %, more than double the life expectancy, widely used in street lamps, mining lights, cable lights, shoe box lights, multi-function lights and other applications.
Yang Hongwu, General Manager of Dalian 3D Heat Transfer Technology Co., Ltd.
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