In the first half of 2008, China's semiconductor lighting industry maintained a good momentum of development and growth rate, especially the production capacity of epitaxial chip companies has been greatly improved, packaging enterprises to improve the level of automation, road lighting-based lighting applications have achieved certain development . At the same time of rapid industrial growth, the domestic industrial structure has also been greatly improved. The scale of leading enterprises in the industry has continued to expand, and industrial concentration has improved.
However, since the second half of 2008, the semiconductor lighting industry has begun to be affected by the financial crisis to varying degrees. Since the second half of the year, corporate sales have decreased significantly. According to preliminary statistics, the monthly sales of most semiconductor lighting companies in the fourth quarter of 2008 decreased by about 30% compared with the first half of the year. Some of the low-end products and small-scale enterprises were the most affected, and monthly sales fell by more than 50. %.
From the perspective of the whole year, the development of semiconductor lighting in China still maintains growth, but its development is somewhat different from the forecast at the beginning of the year.
In 2008, China's epitaxial chip equipment increased rapidly, and chip production capacity increased rapidly. According to statistics, domestic MOCVD has more than 100 units, of which more than 85 production GaNMOCVDs have been installed, and about 15 production MOCVDs, and research equipment at domestic research institutes has also increased. Although affected by the financial crisis, the epitaxial chip investment plan is bound to be adjusted, but it is expected that the increase of MOCVD in China will be no less than 30 in 2009, and the production capacity of epitaxial chips will continue to grow rapidly.
In 2008, China's chip output value increased by 26% to 1.9 billion yuan, a decrease from the 43% growth rate in 2007. The domestic GaN chip output value was 1.1 billion yuan, an increase of 37%, and also lower than 78% in 2007. In 2008, the production capacity of domestic GaN chips increased significantly, up 45% from 2007, reaching 1400kk/month, while the actual annual output increased by 34% to 13 billion, and the national productivity also increased to 41%. The performance of domestic chips has been greatly improved, and high-end applications such as display screens, signal lights, outdoor lighting, and small and medium-sized backlights have been recognized. In 2008, due to the financial crisis and Taiwanese corporate chip bidding, domestic chip companies will be under greater operational pressure in the first half of 2009, but it is expected that the average growth rate of domestic chip capacity will still be above 30% in the next few years.
In 2008, the output value of China's LED packaging reached 18.5 billion yuan, up 10% from the 16.8 billion yuan in 2007; the output increased by 15% from 82 billion in 2007 to 94 billion, of which the output value of high-brightness LED reached 14 billion yuan. Accounting for 76% of total LED sales. At the same time, from the point of view of product and enterprise structure, there is also a big improvement in China, and SMD and high-power LED packaging are growing rapidly.
In 2008, the output value of China's applied products has exceeded 45 billion yuan. LED full-color display, solar LED, landscape lighting, consumer electronic backlight, signal, indication and other applications are still the main application areas. In 2008, domestic outdoor lighting developed rapidly, and more than 100,000 LED demonstration application street lamps have been applied. It is expected that the industrial scale will soon be formed. The public area lighting in the city has also begun to demonstrate applications, and has made some progress in LCD-TV backlights and car lights, but it will take some time to form an industrial scale.
In 2008, China was investigated by the United States 337 twice, involving 11 domestic enterprises, covering the industry's chip, packaging, and application industry chains. The patent issue has directly affected the development of domestic industries. According to the survey, in large-scale enterprises with foreign markets, how to deal with patent issues has become a problem that must be solved for further development of enterprises.
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Flanged Ground Screw For Solar Mounting
Flanged Ground Screw for solar energy mounting system .different size flange ( head plate ) ,usualy flange size is 220*8mm ,200*8mm ,with square flange,round flange,hexagon flange ,triangle flange .
Helix flanged ground screw made of carbon steel Q235 ,standard of DIN EN ISO 1461-1999 .
Flange Ground screw parameter are as below :
Ground screw pipe diameter :60mm,68mm,76mm,89mm,102mm,114mm
Ground Screw pipe thickness :2.5mm,2.75mm,3.00mm,3.75mm,4.00mm,4.5mm
Ground Screw Pile length : 1000mm,1200mm,1400mm ,1500mm,1600mm,1800mm,2000mm,2100mm,2500mm,2700mm,3000mm .
Ground Screw material : carbon steel Q235
Surface treatment : hot dip galvanized .according to standard :DIN EN ISO1461-1999 ,average thickness of zinc coating :85micron
Drawing force parameter :10.7-28.5KN
Bearing capacity :20-40KN
Horizontal torsion parameters :4.5-10.5KN
packing :steel pallet
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