In recent years, the application of light-emitting diodes ( LEDs ) has been growing, covering a wide range of markets, including automotive lighting applications such as indicator lights, spotlights and headlights, camera functions such as display backlights and camera flashes. Consumer products such as LED display backlights and projection systems, architectural features such as architectural lighting and signs, and many other applications. The LED has high brightness, high luminous efficiency and fast response. Incandescent lamps have been replaced in many ways due to their low energy consumption, long service life, low heat release and the ability to emit colored light.
As the efficiency of LEDs continues to increase, the amount of lumens per watt that is generated continues to increase, and the use of LEDs for general illumination becomes more and more practical. For example, in 2003, a fluorescent tube equivalent to 3000 lumens required more than 1300 LEDs with an efficiency of 30 lumens per watt to achieve comparable results. However, by 2005, the number of LEDs required to achieve the same fluorescent tube illumination was reduced by a factor of 20, requiring only about 50, each LED having a luminous efficiency of 50 lm/W or higher and a luminous intensity of 60 lumens.
LED lighting level
There are four links in LED production, or four areas. The first link is called product link 0, which refers to the production device itself. The second link of product link 1 is the first-level package, which refers to the method of connecting the device to the power supply through chip bonding and wire bonding to form a surface mount package. The third link of product link 2 refers to the secondary package. Put multiple primary packages together to create the light output required for an external signal or outdoor lighting application. The fourth link, product link 3, is to systematically package the entire system or solution.
The primary LED package includes a single LED and a complex LED matrix package. In a standard LED array, each LED is connected to a substrate electrode. LEDs can be handled separately or connected together. Most of this type of package utilizes epoxy adhesive chips. For high-brightness LED applications, such as outdoor lighting or tail-projection screen illumination, a matrix-structured LED is required. In this configuration, the LEDs are arranged in tight rows and columns to obtain as much light as possible. Figure 1 is a matrix diagram of LEDs that together emit a large amount of lumens. The number and alignment of the LEDs requires good thermal conductivity of the die attach material to keep the LEDs as cold as possible.
Figure 1 LED matrix diagram
Matrix LED packages are the basis for many systems in production. Their recent popularity is due to the fact that this structure can get more lumens per watt of power. However, matrix LED packages pose significant challenges for chip bonding and wire bonding compared to single-chip packages. High-brightness LED applications require maximum heat transfer to meet performance requirements.
Package high brightness LED
Matrix LED process steps include material preparation, chip pick and place, pulse reflow, cleaning, wire bonding, and testing. The following discussion will focus on pulse reflow (low temperature eutectic bonding) and wire bonding steps. An example is a 98 290 祄 LED matrix using AuSn bonding. The LEDs are electrically connected together in the column direction. The goal is to connect the LEDs to the substrate using metallurgical eutectic interconnects, placing the LEDs as close as possible based on component tolerances (a gap of about 1 mil). Figure 2 shows the 290-inch LED matrix.
Figure 2 Attach 290 micron LED to AuSn before wire bonding
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