[Annual Meeting] compete for the LED market outlet: subdivided into king

[Text|High-tech LED reporter Yue Mengdi] The old saying goes, "There is a specialization in the industry." If a person's ability is strong, it will not be possible to do everything. The company is the same, the strength is strong, and it is impossible to cover all aspects. Refinement and specialization are new requirements put forward by the market for enterprises in various fields of the LED industry.

In the view of Wu Yongsheng, general manager of Xinguanglian Semiconductor, the situation of the upstream chip market is constantly changing. Facing the market changes, Xinguanglian’s strategy is to continuously introduce something different in key technologies and pay it to the market. Demand, planning for market segments.

Although 2014 is the first year of LED lighting, the upstream chip has also a great recovery, but behind the shortage of supply, the price has not rebounded. To change this situation, the chip factory must innovate in technology, continuously improve the yield of the product itself, strengthen the control of the cost, and make the existing products to the extreme, while looking for new breakthroughs.

Everyone has his strong and weak points. Adhere to Huacan Optoelectronics, which only focuses on chips, the future goal is to be a professional independent supplier, rather than doing it all. Huang Huishi, director of R&D of Xinguanglian Semiconductor, also said that the company will grasp the characteristics of each product, be more sophisticated, segment the market, and differentiate products.

The unanimous development orientation and strategy reflect the fact that upstream chip manufacturers are becoming more and more aware of the subdivisions.

Adjusting the development strategy and improving the concentration is not only considered by upstream companies. Midstream packaging companies are also doing similar considerations.

Different LEDs have different development directions, and the packaging positioning of the market segments has put forward more requirements for accessories, including power supply, drive, and light distribution. Different subdivided package devices require their packaged manufacturers to re-develop modules, which will obviously change the production of peripheral packaging.

LED packaging forms and technologies are all in full bloom, but they also face some incomplete accessories and different product standards. Some packaged products may be more in the customization stage. Zou Yiming, general manager of Xinyue Optoelectronics, told the reporter of "High-tech LED" that the new technology such as chip-level packaging and flip-chip is emerging in the market. The company will not have large investment for the time being, but will conduct preliminary experiments and evaluations until the market matures.

This idea coincides with Mulinsen. Lin Jili, general manager of the Mulinsen LED Lighting Division, said at the 2014 High-Tech LED Annual Meeting: “In order to meet individual needs, companies must first undergo a comprehensive evaluation, including research and development, materials and other costs, and customer growth, and then consider production.”

In fact, personalized products are innovations in a sense. Innovation cannot exist only in the laboratory, but in the business environment, individualized innovation can be turned into commercial value and profit. But transforming a personalized product into a generic product requires a process. "Subdivided packaging mainly depends on the market demand. If the quantity is not up, it will be difficult to promote." Lin Jiliang said.

In 2014, the line will be over, and the market is generally optimistic. In 2015, where the focus of product research and development should be placed, companies must have a preliminary idea.

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